What Is the Difference Between SMT and Through-Hole Assembly?

When it comes to assembling printed circuit boards (PCBs), two primary techniques dominate the industry: Surface Mount Technology (SMT) and Through-Hole Technology (THT). Each plays a distinct role in how components are attached to the PCB, and choosing the right one can make or break your product’s performance.

 Surface Mount Technology (SMT)

• Components are placed directly onto the PCB surface.

• Offers higher component density and supports miniaturization.

• Ideal for automated production and high-volume manufacturing.

• It is commonly used in smartphones, laptops, and wearable devices.

  
  

Through-Hole Technology (THT)

• Involves inserting component leads through drilled holes in the board.

• Soldered from the opposite side for a strong mechanical bond.

• Best for high-stress applications such as aerospace, automotive, or industrial equipment.

• When to Use Which?

• SMT is great for compact, high-speed production.

• THT is preferable where durability and physical strength are crucial.

• Many manufacturers use a hybrid approach to optimize performance and cost.

  
  

Pro Tip:

At 330 Electronics, we specialize in both SMT and THT processes—leveraging the strengths of each to create durable, high-performance PCBs tailored to your needs.

Close-up view of a printed circuit board featuring through-hole components and intricate circuitry pathways.